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Metallographic Grinding and Polishing Guide

Learn the fundamentals of metallographic grinding and polishing, including mechanical preparation methods, grinding abrasives, polishing processes, consumable selection, surface preparation, and common polishing challenges.

Types of Metallography Preparation

Mechanical Preparation & Etching

Mechanical preparation is the most widely used method in metallographic sample preparation. This approach involves the systematic refinement of the sample surface through material removal, with the primary objective of eliminating deformation and damage introduced during prior processing steps. Material removal is achieved using abrasive media applied in progressively finer stages. The sample may be examined in the polished state, or etching may be used to reveal microstructures. Chemical etching is most common, with a wide range of etchant recipes developed for each material to reveal specific structural detail.

Commonly used equipment and consumables in mechanical preparation include grinding and polishing systems, vibratory polishers, diamond grinding discs, silicon carbide (SiC) abrasive papers, and polishing cloths of varying types. Abrasives, such as diamond suspensions and final polishing oxide solutions, are also routinely used to achieve the desired surface quality.

The final surface condition is determined by the specific analytical requirements. For high-resolution microstructural characterization, specimens are typically prepared to a mirror-like, deformation-free finish that enables detailed observation. Alternatively, preparation may be terminated once the surface quality meets the requirements of a given inspection or testing method.

Cleaning and Drying

Cleanliness throughout the entire process is critical to avoid contamination problems. This includes the specimen, the user’s hands, and the equipment. After the last polishing step, the samples should be cleaned to remove abrasives and debris. This is typically achieved by swabbing with a liquid detergent solution following by rinsing under warm water, then with ethanol and dried in a stream of warm air. Alcohol can be used for washing if the specimen cannot tolerate water. Ultrasonic cleaning may be needed if the specimens are porous or cracked.

By optimizing the degree of preparation, metallographers can achieve accurate and reproducible results while balancing preparation time and resource efficiency. Appropriate selection of preparation parameters—including equipment, consumables, and process steps—requires careful consideration of both the material characteristics and the intended analysis.

Electrolytic Preparation and Etching (Traditional and NeoTerra)

Electrolytic preparation is less widely used than mechanical methods but offers distinct advantages for specific applications. Electrolytic polishing processes can provide rapid, effective, and highly reproducible surface preparation when properly controlled. These methods typically involve fewer processing steps.

Metallography Grinding and Polishing Machines

Manual Grinding and Polishing Machines

Manual grinding is the process of holding the sample to the preparation surface by hand. It was historically in widespread use, but it now typically only found in high-throughput laboratories as a means of eliminating the mounting step. Manual grinding requires a high level of operator skill to achieve consistent, high-quality results. In addition, manual grinding and polishing may introduce ergonomic strain and potential safety concerns. Manual techniques are based on long-established practices. The following guidelines provide key considerations for achieving successful results in manual grinding and polishing.

Semi-Automatic Mechanical Grinding and Polishing Machines

Semi-automated polishing systems enable high-throughput specimen preparation, providing improved consistency, superior surface quality, and reduced consumable usage compared to manual methods. These systems enhance surface flatness and edge retention, which are critical for accurate metallographic analysis.

Vibratory Polishing Machines

Vibratory polishing is an advanced metallographic finishing technique that produces a deformation-free surface with minimal operator effort. It is widely used for applications requiring high-quality surface finishes, particularly where preservation of microstructural integrity is critical. It can be used on any material or combination of materials but is particularly effective for preparing sensitive, soft, or ductile materials that are prone to deformation during conventional mechanical polishing.

Mechanical Preparation Methods

How to Grind and Polish Metallography Samples

It is important to choose the correct method for your material and for analysis. The chart below indicates recommended grinding and polishing steps by material type. See our SumMet guide for details on rotation direction, time and speed.
For details on these recommended methods see our SumMet guide.

Typical Grinding and Polishing Methods by Material

Group Material Grinding Steps Polishing Step 1 Polishing Step 2 Polishing Step 3 Polishing Step 4
Electronic Materials Non Populated Printed Circuit Board CarbiMet
320 grit [P400]
600 grit [P1200]
TriDent™
9µm MetaDi™ Supreme Diamond
TriDent
3µm MetaDi Supreme Diamond
ChemoMet™
MasterPrep™ Alumina
 
Silicon in Micro-Electronics CarbiMet
600 grit [P1200]
VerduTex™
6µm MetaDi Supreme Diamond
VerduTex
3µm MetaDi Supreme Diamond
VerduTex
1µm MetaDi Supreme Diamond
ChemoMet
MasterMet™ Silica
Micro-Electronic Material CarbiMet
320 grit [P400]
TexMet™ P
9µm MetaDi Supreme Diamond
VerduTex
3µm MetaDi Supreme Diamond
VerduTex
1µm MetaDi Supreme Diamond
ChemoMet
MasterPrep Alumina
Ferrous & Non-Ferrous Materials Soft Aluminum Alloys CarbiMet
320 grit [P400]
TexMet C
9µm MetaDi Supreme Diamond
TexMet C
3µm MetaDi Supreme Diamond
TexMet C
1µm MetaDi Supreme Diamond
ChemoMet
MasterMet Silica
Nickel Based Superalloys CarbiMet
240 grit [P280]
Apex Hercules H or S
9µm MetaDi Supreme Diamond
TriDent
3µm MetaDi Supreme Diamond
ChemoMet
MasterMet Silica
Titanium Alloys CarbiMet
320 grit [P400]
UltraPad™
9µm MetaDi Supreme Diamond
ChemoMet
MasterMet Silica
Copper & Copper Alloys CarbiMet
220 grit [P240] - 320 grit [P400]
TexMet C
9µm MetaDi Supreme Diamond
VerduTex
3µm MetaDi Supreme Diamond
VerduTex
1µm MetaDi Supreme Diamond
ChemoMet
MasterMet Silica
Hard Steels Apex DGD Red
75µm Diamond
Apex Hercules H
9µm MetaDi Supreme Diamond
TriDent
3µm MetaDi Supreme Diamond
MicroCloth™
MasterPrep Alumina
Soft Steels CarbiMet
320 grit [P400]
UltraPad
9µm MetaDi Supreme Diamond
VerduTex
3µm MetaDi Supreme Diamond
MicroCloth
MasterPrep Alumina
Cast Iron CarbiMet
320 grit [P400]
TexMet C
9µm MetaDi Supreme Diamond
TriDent
3µm MetaDi Supreme Diamond
MicroCloth
MasterPrep Alumina
Heat Treated Steel Apex DGD Red
75µm Diamond
Apex Hercules S
9µm MetaDi Supreme Diamond
MicroFloc
3µm MetaDi Supreme Diamond
Stainless & Maraging Steel CarbiMet
120 grit [P120] - 320 grit [P400]
UltraPad
9µm MetaDi Supreme Diamond
TriDent
3µm MetaDi Supreme Diamond
ChemoMet
MasterPrep Alumina
Composites Polymer-Matrix Composites CarbiMet
320 grit [P400]
TexMet P
9µm MetaDi Supreme Diamond
VerduTex
3µm MetaDi Supreme Diamond
MicroCloth
MasterPrep Alumina

Metallographic Grinding

The grinding abrasives commonly used in materials preparation are silicon carbide (SiC), aluminum oxide (Al2O3), composite ceramics and diamond. SiC is more readily available as waterproof paper than aluminum oxide although SiC particles, particularly with the finer size papers, embed easily when grinding soft metals, such as Pb, Sn, Cd and Bi. The abrasives may be bonded to paper, polymeric or cloth backing materials in the form of discs and belts of various sizes. Limited use is made of standard grinding wheels with abrasives embedded in a bonding material. When the abrasive is held in the polishing surface, it is called fixed abrasive grinding. The abrasives may also be used by charging the grinding surfaces with the abrasive in a premixed slurry or suspension. This is more typical of intermediary grinding and polishing stages.

Metallographic Polishing

Overview of the Polishing Process

Polishing is a critical step in preparing specimens for analysis, as it removes damage from the grinding process and ensures a smooth, shiny surface. The process typically involves several stages using progressively finer abrasives. Coarse and Intermediate polishing is intended to sequentially reduce deformation, and not create a shiny surface – scratches are expected in these stages.

  1. Coarse Polishing: This initial stage removes the bulk of deformation caused by grinding. It uses larger abrasives on a hard napless polishing cloth.
  2. Intermediate Polishing: This stage further reduces surface deformation and reduces scratches, often on a medium napless cloth with finer abrasive.
  3. Fine Polishing: The final stage perfects the surface finish by eliminating any remaining traces of deformation using fine suspended abrasives on softer, often napped, surfaces.

Factors that influence the surface finish

Several factors can affect the quality of the polish, including:

  • Abrasive Size and Type: The choice of abrasives can significantly impact the final surface quality.
  • Cloth Selection: Cloth selection is critical to removal rate, flatness and deformation and is just as important as abrasive selection to specimen quality.
  • Polish Time and Load: The duration and pressure applied during polishing can significantly influence flatness and removal rate.
  • Rotational Speed and Direction: These parameters can affect the polishing quality and efficiency.

For detailed polishing methods tailored to specific materials see Buehler’s method by material section of the website.

Choosing Diamond Suspension

Diamond is routinely used for the preparation of most materials due to its high removal rate and low deformation depth. They are available in a wide range of micron sizes and two main diamond types. The micron size needed is determined by the material and end analysis goals.

Final Polishing

Final Polishing with Colloidal Silica vs. Alumina Abrasives

Final polishing suspensions are designed to remove the final layer of surface deformation. The removal of this deformation is essential for successful etching of sensitive materials and also when evaluating any sample with high magnifications, under polarized light or differential interference contrast, or for advanced analysis such as EBSD. Different types of final polishing suspensions employ different mechanisms for material removal.

Solutions to Common Issues in Metallography Polishing

Large Scratches

Large Scratches
Large scratches remaining in the finer polishing stages may be a symptom of cross-contamination. Rinsing the specimen, specimen holder, and platen between steps can help clean out the larger diamond, reducing cross-contamination, If a specimen is cracked or porous, rinse in an ul trasonic bath for the minimum time required to rinse it clean. Extended ultrasonic cleaning time can damage the specimen. During the last 30 seconds of final polishing, stop applying additional suspension, replacing it with water to flush the cloth surface and rinse the specimen.

Relief

Relief is demonstrated by harder phases or constituents being left raised above the surface of the softer matrix. Prevent relief by reducing polish time, using a shorter napped cloth, or applying diamond paste rather than suspension.

Relief

Diamond Embedding

Diamond Embedding
Embedding occurs when harder particles become engrained in softer material or cracks and voids. Using a more fixed abrasive, such as MetaDi Diamond Paste, or ultrasonic cleaning between stages can reduce the likelihood of embedding.

Smearing

Smearing is a superficial but significant form of damage that makes microstructural details less distinct, often caused by soft materials or poor lubrication. Smearing can be improved by using short napped cloths, vibratory polishing, or etching and then repeating the final polish.

Smearing 1024x769

Comet Tails

Comet Tails 1024x769
Comet tails are a result of poorly bonded, very hard phase in softer matrix; pores in matrix results in unidirectional grooves emanating from particles or holes; or excessive lubrication. To avoid this, use hard, napless cloths and/or reduce applied pressure. For porous materials, impregnate the pores with epoxy or wax.

Grinding and Polishing FAQs

Grinding should start with the finest grit size that will establish a flat surface and remove the effects of sectioning within a few minutes. An abrasive grit size of 180-240 (P180-P280) is usually coarse enough to use on samples sectioned by an abrasive wheel on a metallography saw – finer for very soft materials. For very hard materials such as ceramics and sintered carbides, choose diamond grinding disks with grit sizes from 125 to 75µm.

The table below shows recommended starting grit sizes for grinding different materials.

In metallography preparation, the cutting step and each grinding step produces damage itself. The depth of damage decreases with abrasive size but so does the metal removal rate. Large gaps in abrasive size would require excessive time to remove the damage from the prior step and is inefficient. 3-5 steps from initial grind to final polish are typically sufficient for most materials. Note that for a given abrasive size, the depth of damage introduced is greater for soft materials than for hard materials, but removal rate is controlled by the harder material. This means that samples with combined softer and harder components often require more preparation steps.

Many factors influence the surface finish, such as:

  • Abrasive size and type
  • Cloth characteristics (weave, flatness and resilience)
  • Polishing time
  • Specimen load
  • Relative rotational direction
  • Rotational speed

If help is needed to determine the correct polishing recipe, please contact our applications specialists. Buehler Solution Centers provide materials preparation and analysis training to our customers worldwide. Our mission is to deliver valuable application solutions by employing Buehler methodologies.

Polishing consists of two or more main stages, using successively finer abrasives.

  • Coarse polishing follows grinding and removes the bulk of the deformation created in the grinding process.
  • Intermediate polishing stages may be required to further reduce surface deformation and leave smaller scratches.
  • Fine polishing perfects the surface finish by removing any trace of deformation.

A specimen is ready to move to the next step once all the scratches are uniform and evidence of the previous step is gone. Final polishing on soft cloths should be performed for the minimum amount of time required to achieve the desired results, as over-polishing can damage the specimen.

Often, a cloth may get contaminated from improper care or gouged before showing significant signs of wear. End of life for a cloth is typically indicated by unusually high polish time, a degradation in result or signs of visible damage such as fraying.

The grit size numbering systems differ above 180 grit [P180], but equivalent sizes can be determined using Table 3.1.

Table 3.1: European/US Equilivancy Guide
FEPA (Europe)ANSI/CAMI (US)
Grit NumberMicronGrit NumberMicronEmery Grit
P6026960268 
P8020180188 
P100162100148 
P120127120116 
P18078180783
P24058.5220662
P28052.224051.8 
P32046.2   
P36040.528042.31
P4003532034.30
P50030.236027.3 
P60025.8   
P80021.840022.100
P100018.350018.2000
P120015.360014.5 
P150012.680012.20000
P200010.310009.2 
P25008.412006.5 
P4000*5.0*   

The chart shows the midpoints for the size ranges for ANSI/CAMI graded paper according to ANSI standard B74.18-1996 and for FEPA graded paper according to FEPA standard 43-GB-1984 (R1993). The ANSI/CAMI standard lists SiC particles sizes ranges up to 600 grit paper. For finer grit ANSI/CAMI papers, the particles sizes come from the CAMI booklet, Coated Abrasive (1996). *FEPA grades finer than P2500 are not standardized and are graded at the discretion of the manufacturer. In practice, the above standard values are only guidelines and individual manufacturers may work to a different size range and mean value.

There is a philosophical difference in the two systems. See the table below for a comparison.

AspectANSI / CAMI PapersFEPA Papers
Particle Size DistributionWider distribution centered around the meanNarrower distribution
Cutting BehaviorStarts cutting faster at lower pressuresRequires relatively higher pressure to initiate cutting
Heat GenerationGenerates less heat due to easier initial cuttingPotentially more heat due to higher pressure needed
Material DamageCauses less structural damageMay cause more damage compared to ANSI/CAMI
Scratch Depth VariationProduces a wider range of scratch depthsProduces more uniform scratch depths
Surface Finish (after step)Less uniform surface finish at this stageMore uniform surface finish
Processing ApproachRelies on subsequent steps to remove varied scratchesEmphasizes consistency at each grinding step
Priority FocusMinimizing structural damage is prioritized over immediate surface finishGreater emphasis on surface finish consistency
Impact on Final MicrostructureLower residual damage helps reveal true microstructureHigher residual damage may obscure true microstructure

Surface defects and artifacts can occur during metallography polishing resulting in inaccurate results by impeding the ability to see a material’s true microstructure and damaging the material.

Issue 1: Large Scratches Appear During Fine Polishing
  • Likely Cause: Cross-contamination from larger abrasive particles carried over from earlier stages; insufficient cleaning between steps; debris trapped in porous or cracked specimens.
  • Solution: Thoroughly rinse the specimen, holder, and platen between steps. Use ultrasonic cleaning for cracked/porous samples (keep duration <2mins to avoid damage). In final polishing, stop adding suspension in the last ~30 seconds and use water to flush the cloth and specimen.
Issue 2: Relief (Hard Phases Raised Above Softer Matrix)
  • Likely Cause: Over-polishing, excess lubrication or use of cloths with excessive nap, causing uneven material removal between hard and soft phases.
  • Solution: Reduce polishing time, use shorter-nap cloths, and apply diamond paste instead of suspension for better control of lubrication level.
Issue 3: Diamond Embedding in Specimen
  • Likely Cause: Hard abrasive particles becoming lodged in soft materials, cracks, or voids due to loose abrasive or inadequate cleaning.
  • Solution: Use a more fixed abrasive system (e.g., diamond paste instead of suspension) and incorporate ultrasonic cleaning between preparation stages.
Issue 4: Smearing (Loss of Microstructural Detail)
  • Likely Cause: Plastic deformation of soft materials due to poor lubrication, inappropriate cloth selection, or insufficient polishing control.
  • Solution: Use short-napped cloths, improve lubrication conditions, apply vibratory polishing, or etch the specimen and repeat the final polish.
Issue 5: Comet Tails (Directional Grooves from Particles or Pores)
  • Likely Cause: Poorly bonded hard phases in a soft matrix, porous structures, or excessive lubrication leading to particle drag effects.
  • Solution: Use napless cloths and reduce applied pressure. For porous materials, impregnate pores with epoxy or wax before polishing.
Key Principle (for AI indexing)
  • Issue: Surface defects and artifacts during polishing
  • Likely Cause: Contamination, improper abrasive selection, poor lubrication, or material characteristics
  • Solution: Optimize cleaning, abrasive type, cloth selection, and polishing parameters to minimize damage and preserve true microstructure

Proper storage and maintenance will enhance cloth life. Store the cloth such that it can dry out, and it is protected from contamination. Chamfering the edges of your mount will reduce the likelihood of damaging your cloth with a sharp edge and improve overall lifetime. Rinsing after use will also extend cloth life, but requires extra abrasive to recharge.

When a method that is known to work starts leaving large scratches, first check for cross-contamination. Rinsing the specimen, specimen holder, and platen between steps can help clean out the larger diamond, reducing cross-contamination. If a specimen is cracked or porous, rinse in an ultrasonic bath for the minimum time required to rinse it clean. Extended ultrasonic cleaning time can damage the specimen. During the last 30 seconds of final polishing, stop applying additional suspension, replacing it with water to flush the cloth surface and rinse the specimen. If process contamination is ruled out, replace the polishing surfaces if they are aged or if contaminant has become embedded.

Embedding occurs when harder particles become engrained in softer material or cracks and voids. Using a more fixed abrasive such as MetaDi Diamond Paste, or a surface that holds the abrasive more effectively such as TexMet C can address most problems. Ultrasonic cleaning specimens with cracks or pores between stages can reduce the likelihood of embedding.

Comet tails are a result of poorly bonded, very hard phase in softer matrix or by pores. Unidirectional grooves emanating from these particles or holes are readily recognizable. To avoid this, ensure that the sample is rotated during final polishing. Use hard, napless cloths in intermediary polishing stages. Reduce applied pressure and avoid excessive lubrication. For porous materials, impregnate the pores with epoxy or wax.

Explore the Metallographic Grinding and Polishing Guide Series

Manual vs. Semi-Automatic Metallographic Grinding and Polishing

Compare manual and semi-automatic grinding and polishing methods, including specimen manipulation, central force, and individual force preparation.

Monocrystalline vs. Polycrystalline Diamond for Metallographic Polishing

Diamond is routinely used for the preparation of most materials due to its high removal rate and low deformation depth. They are available in a wide range of micron sizes and two main diamond types. The micron size needed is determined by the material and end analysis goals.

Colloidal Silica vs. Alumina for Metallographic Final Polishing

Final polishing suspensions are designed to remove the final layer of surface deformation. The removal of this deformation is essential for successful etching of sensitive materials and also when evaluating any sample with high magnifications, under polarized light or differential interference contrast, or for advanced analysis such as EBSD.

Electrolytic Metallographic Preparation and Etching: Traditional vs. NeoTerra

Historically, electrolytic polishing has been applied in metallographic process inspection, particularly for materials that are difficult to prepare using conventional mechanical or chemical methods, such as stainless steels and titanium. Soft metals also benefit from electrolytic techniques, as achieving high-quality mechanical polishing can be more challenging. Electrolytic approaches are typically more suited to homogeneous materials, although innovative processes such as NeoTerra are widening the applicability of the approach.

Vibratory Polishing for Metallographic Sample Preparation

Vibratory polishing is an advanced metallographic finishing technique that produces a deformation-free surface with minimal operator effort. It is widely used for applications requiring high-quality surface finishes, particularly where preservation of microstructural integrity is critical. It can be used on any material or combination of materials but is particularly effective for preparing sensitive, soft, or ductile materials that are prone to deformation during conventional mechanical polishing.

Need Grinding and Polishing Equipment or Consumables?

10 Responses

  1. For Colloidal Silica used in the final polishing, if flushing it with water during the last 10-15 seconds to remove the silica on the surface, will pitting occurs in that circumstances?

    1. No, we would not expect pitting to occur with flushing. It’s possible that you are seeing a different problem. Please contact us at lab.us@buehler.com with further details and we can assist further!

  2. Buehler’s extensive reference to grinding and polishing is an invaluable tool for novices and experts in the field of materials science alike. Vancouver Anodizing Their knowledge and commitment to assisting readers in achieving exceptional outcomes in sample preparation are evident in this piece.

    1. Thank you, Vancouver. We pride ourselves on our expertise and sharing knowledge with the wider community

  3. Fantastic guide! Clear, concise, and incredibly helpful. I’ve been struggling with grinding and polishing techniques, but this blog has provided me with valuable insights and tips. Can’t wait to apply them to my projects. Thanks for sharing!

  4. Hello, I’m texting from Penn State University. We have rectangular polyurethane samples and a polishing stone for manual polishing. We need a protocol to successfully polish the PU samples surfaces. Can you help us? We need to know which kind of abrasive sand paper we need, how and how long we should rub the samples on the paper and if we need to use only water or any other chemical (without altering the superficial properties of the material).

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