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How to Avoid Common Problems When Polishing with Colloidal Silica

Why Use Colloidal Silica for Final Polishing?

Colloidal silica is an exceptional final polishing solution for a wide variety of different materials. It uses a mixture of chemical and mechanical polishing to improve removal rate whilst also reducing surface deformation, making it the polishing compound of choice for high quality preparation.  When used correctly it is an invaluable tool in a metallographer’s utility belt.  However, in the wrong hands it will only bring misery.

How Crystallized Colloidal Silica Causes Scratches

If you find large scratches suddenly appearing during finish polishing, it may be due to contamination from crystallized colloidal silica. If colloidal silica is allowed to dry onto a cloth the amorphous, sub-micron silica will crystallize to form larger particles that don’t break down. These silica crystals can create large scratches – especially in soft samples – ruining someone’s hard work, as the only way to fix it is to go back a couple of stages and do it again with a fresh cloth.

How to Prevent Colloidal Silica Polishing Problems

To prevent problems, follow these simple steps:

  • Wet the cloth with water prior to use – this prevents the colloidal silica drying out when its applied
  • Keep the cloth damp by regular addition of polishing media – never let it get dry
  • Rinse the cloth, samples and holder with water during the last 20-30 seconds of the polishing step. Most of the work in keeping the cloth in optimum condition is achieved by doing this.
  • At the end of each period of use, run water onto the cloth and set to low rpm. Use a hard plastic edge to squeegee the cloth, removing any remaining colloidal silica.

Colloidal Silica with Anti-Crystallization Additives

One can also use Colloidal Silica with additives that minimize crystallization, likes Buehler’s MasterMet 2 Colloidal Silica.  These reduce the amount of cleaning necessary, but usually have an inferior polishing rate.

Explore the Metallographic Grinding and Polishing Guide Series

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Monocrystalline vs. Polycrystalline Diamond for Metallographic Polishing

Diamond is routinely used for the preparation of most materials due to its high removal rate and low deformation depth. They are available in a wide range of micron sizes and two main diamond types. The micron size needed is determined by the material and end analysis goals.

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