--- title: Solutions by Material Printed Circuit Boards url: https://www.buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-printed-circuit-boards/ date: 2024-06-03T15:50:49+00:00 modified: 2024-06-03T20:21:04+00:00 lang: en_GB --- # Solutions by Material Printed Circuit Boards Solutions By Materials: # Printed Circuit Boards ## Metallographic Preparation Solutions by Material Use this guide for advice on where to start when performing metallographic preparation and analysis on printed circuit boards (PCBs). Included are tips for achieving the best results for your metallographic application. [![Buehler Sectioning Products](https://buehler.com/uk/wp-content/uploads/sites/4/2023/09/Sectioning-Products-Hexagon.png)](#cutting) [General Cutting](#cutting) [![Buehler Mounting Products](https://buehler.com/uk/wp-content/uploads/sites/4/2023/09/Mounting-Products-Hexagon.png)](#mounting) [General Mounting](#mounting) [![Buehler Grinding & Polishing Products](https://buehler.com/uk/wp-content/uploads/sites/4/2023/09/Grinding-Polishing-Hexagon.png)](#gp) [General Grinding & Polishing](#gp) ### Things to consider when working with printed circuit boards ![Things to consider when working with printed circuit boards](https://buehler.com/uk/wp-content/uploads/sites/4/2024/06/Things-to-consider-when-working-with-printed-circuit-boards-1024x683.jpg) Printed circuit boards (PCBs) can be analyzed to measure a variety of things. Undercut, outgrowth, overhang and blistering are only a few of the possible properties that are looked for when analyzing PCBs. Often micro-cross-sectioning is done to ensure the finished board meets IPC or military specifications. These standards have stringent requirements for surface finish that warrant careful consideration of processing. Ensuring samples are scratch-free, flat, and perpendicular to the grinding surface throughout the preparation process minimizes errors in assessing components. #### Printed Circuit Boards Cutting Tips ![Abrasive Cutting Tips](https://buehler.com/uk/wp-content/uploads/sites/4/2024/06/Abrasive-Cutting-Tips-for-Aluminum-1024x683.jpg) All sectioning should be performed wet, with an ample flow of [coolant](https://www.metallography.biz/sectioning.php) directed into the cut. Wet cutting will produce a smoother surface finish than a dry cut. Using coolant will also guard against surface damage caused by overheating and mechanical strains. Reducing damage while sectioning is important. Mechanical damage, such as fractures can penetrate deep into the structure and make later preparation steps longer. There are two main types of cutting tools offered: Abrasive and Precision. Aggressive sectioning can cause mechanical and thermal damage and should be avoided. Due to this, abrasive sectioning is generally not recommended. Precision sectioning results in excellent cut surface quality and can be used to section close to the target area. Routers can also be used to section PCBs into coupons. Some manufacturing sites incorporate testing areas into their boards. These areas are used for testing quality. Coupons can be pressed out of the board, alternately a band saw can be used to remove the general area followed by a precision saw to remove the coupons. #### Precision Cutting Tips ![Precision Cutting Tips](https://buehler.com/uk/wp-content/uploads/sites/4/2024/06/Precision-Cutting-Tips-for-Aluminum-1024x683.jpg) [Precision cutters](https://buehler.com/uk/products/sectioning/#precision) are used to section boards near the area of interest without inducing the damage that may result from coarser techniques of sectioning. On the outer edge of the blade there is a section where abrasive has been bonded with metal alloys. With proper care a precision blades can be used to cut thousands of coupons, without replacement. Our [IsoMet® 1000](https://buehler.com/assets/Brochures/English/Sectioning/IsoMet1000Brochure.pdf) has an optional tabletop attachment commonly used for sectioning coupons. | Recommended Precision blades for Tabletop Sectioning of Printed Circuit Boards | | | | | --- | --- | --- | --- | | 5in (127mm) | 7in (178mm) | 8in (203mm) | Dressing Stick | | [11-4239 0.020in \[0.5mm\]](https://www.metallography.biz/product-information.php?pid=114239) | [11-4241 0.025in \[0.6mm\]](https://www.metallography.biz/product-information.php?pid=114241) | [11-4242 0.035in \[0.9mm\]](https://www.metallography.biz/product-information.php?pid=114242) | 30HC blades should not be dressed | #### Printed Circuit Boards Mounting Tips ![Composite Mounting Tips](https://buehler.com/uk/wp-content/uploads/sites/4/2024/06/Composite-Mounting-Tips-1024x683.jpg) Acrylic systems are commonly used for automated preparation of PCBs. One primary advantage of the acrylics is the short cure time, around 10 minutes, though they may not have the desired level of infiltration. Wetting coupons by inserting into acrylic liquid prior to pouring can help pull media into through-holes increasing levels of infiltration. High-quality epoxies such as [EpoxiCure®](https://buehler.com/uk/products/mounting/accessories-consumables/epoxy-mounting-systems/) or [Epothin®](https://buehler.com/uk/products/mounting/accessories-consumables/epoxy-mounting-systems/) are recommended when enhanced infiltration and edge retention are desired. When using epoxy a vacuum system like the SimpliVac can be used to increase inflitration levels. #### Printed Circuit Boards Grinding & Polishing Tips for All Methods ![Grinding Polishing Tips for all Methods](https://buehler.com/uk/wp-content/uploads/sites/4/2024/06/Aluminum-Grinding-Polishing-Tips-for-all-Methods-1024x683.jpg) Printed circuit boards can be prepared in different methods. Two ways are described below, one is a conventional method and the other is a modern method of preparing PCBs. In the conventional way of preparation, samples can be ground manually. Taking one sample and using SiC papers of varying grit sizes to reach the target area. Sometimes papers of each available abrasive size are incorporated into such methods. Manual preparation is less efficient than automated methods and varies in quality depending on the operator. It's possible to combine automated and manual preparation as seen in [Smarter Sample Preparation Method to Improve Quality Control Efficiency in Electronic Industry](https://buehler.com/assets/TechnicalArticles/Smarter-Sample-Prep-for-Electronics-Industry.pdf). Buehler offers specialized accessories for automated grinding to target areas. [PC-Met®](https://buehler.com/uk/products/grinding-and-polishing/accessories-and-consumables/pc-met-and-pwb-met-electronic-solutions/) and [PWB Met® kits](https://buehler.com/uk/products/grinding-and-polishing/accessories-and-consumables/pc-met-and-pwb-met-electronic-solutions/) are used for targeted grinding of standard coupons from boards. Two diamond stop sets are used as a depth measurement method and are adjusted to the target height needed for the desired features. Diamond stops prevent grinding further than the area of interest. Mechanical polishing steps are done after grinding to provide a surface finish that meets IPC and military specifications. Our PC-Met kits allow for automated preparation of 18-36 coupons. These kits are capable of being adjusted to cross section coupons of various dimensions, see the PC-Met brochure for additional information. Using Buehler's [Burst dispensing system](https://buehler.com/uk/products/grinding-and-polishing/accessories-and-consumables/burst-dispensing-system/) can conserve diamonds and improve consistency. The ideal rate for the Burst dispensing system changes with the size of the platen and the polishing cloth that is being used. As a general guideline, for platen size of 8” a burst setting of 3 is a good starting point, for sizes of 10" and 12" set the burst system to 4 and adjust as needed. Some experimentation may be required to determine optimal settings to ensure sufficient abrasive and wetting of the cloth. Burst dispensers are also capable of dispensing extenders simultaneously with diamond, if desired. ![Burst Dispensing System](https://buehler.com/uk/wp-content/uploads/sites/4/2021/10/Burst_Stadium.png) Loads listed in grinding and polishing methods are recommendations for one 1.25" mounted specimen. If using central force during preparation the force listed should be multiplied by the number of samples being polished. For different sample sizes, use our [load conversion calculator](https://buehler.com/uk/solutions/tools/) to determine the correct load for your application. | Method for Modern Preparation of Printed Circuit Boards | | | | | | --- | --- | --- | --- | --- | | Surface | Loads \[N\] | Base Speed \[rpm\] | Relative Rotation | Time | | [CarbiMet® 320 grit](https://www.metallography.biz/grinding-polishing.php) | 3 \[13\] | 300 rpm | ![Relative Rotation](https://buehler.com/assets/solutions/Complimentary-Rotation.png) | Hit edge of target/long stops | | [CarbiMet 600 grit](https://www.metallography.biz/grinding-polishing.php) | 3 \[13\] | 150 rpm | ![Relative Rotation](https://buehler.com/assets/solutions/Complimentary-Rotation.png) | Hit level of interest/short stops | | [TextMet® C](https://www.metallography.biz/product-information.php?pid=423208) with [3um MetaDi® Ultra Polycrystalline Paste](https://www.metallography.biz/product-information.php?pid=406631F) | 5 \[22\] | 150 rpm | ![Relative Rotation](https://buehler.com/assets/solutions/Complimentary-Rotation.png) | 3:00 | | [MicroCloth®](https://www.metallography.biz/product-information.php?pid=423708) with [0.05um MasterPrep® Alumina](https://www.metallography.biz/product-information.php?pid=406377032) | 4 \[18\] | 150 rpm | ![Relative Rotation](https://buehler.com/assets/solutions/Complimentary-Rotation.png) | 1:30 | | ![Platen](https://buehler.com/assets/solutions/platen.png) = Platen ![Specimen Holder](https://buehler.com/assets/solutions/Specimen-holder.png) = Specimen Holder \*Plus MetaDi Fluid Extender as desired | | | | | #### Printed Circuit Boards Imaging Tips ![Imaging Tips](https://buehler.com/uk/wp-content/uploads/sites/4/2024/06/Thermal-Spray-Coating-Imaging-Tips-1024x683.jpg) Some common analysis goals for PCBs are void measurements, delamination examination, microstructure analysis, and coating thickness. Dimensional measurements are easily made with our basic version of [OmniMet® imaging software](https://buehler.com/uk/products/imaging-and-analysis/software/omnimet-software-solutions/). For more complicated analysis, higher tiers of the OmniMet software are better suited. #### Related Products [![IsoMet® 1000](https://buehler.com/uk/wp-content/uploads/sites/4/2021/08/IsoMet-1000_600x600.jpg)](https://buehler.com/uk/products/sectioning/precision-cutters/isomet-1000-precision-cutter/) ##### [IsoMet® 1000](https://buehler.com/uk/products/sectioning/precision-cutters/isomet-1000-precision-cutter/) Precision Saw [![Acrylic Mounting System](https://buehler.com/uk/wp-content/uploads/sites/4/2024/02/Acrylic-Mounting-System.png)](https://buehler.com/uk/products/mounting/accessories-consumables/acrylic-mounting-systems/) ##### [Acrylic Systems](https://buehler.com/uk/products/mounting/accessories-consumables/acrylic-mounting-systems/) Fast Curing Castable Systems [![PC-Met Kit](https://buehler.com/uk/wp-content/uploads/sites/4/2021/10/605090_PC-Met-Ki.png)](https://buehler.com/uk/products/grinding-and-polishing/accessories-and-consumables/specialty-grinding-and-polishing/) ##### [Printed Wired Board Kit](https://buehler.com/uk/products/grinding-and-polishing/accessories-and-consumables/specialty-grinding-and-polishing/) Target Grinding Equipment [![Computers and Monitors for Imaging and Analysis](https://buehler.com/uk/wp-content/uploads/sites/4/2024/04/OmniMet-Software-Solutions.png)](https://buehler.com/uk/products/imaging-and-analysis/software/omnimet-software-solutions/) ##### [OmniMet®](https://buehler.com/uk/products/imaging-and-analysis/software/omnimet-software-solutions/) Image Analysis Software ## All Solutions by Material Choose a material to view Buehler's resources - [Aluminum and Aluminum Alloys](https://buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-aluminum-and-aluminum-alloys/ "Buehler's Method by Material Aluminum") - [Composites](https://buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-composites/ "Buehler's Method by Material Composites") - [Copper and Copper Alloys](https://buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-copper-and-copper-alloys/ "Buehler's Method by Material Copper") - [Electronic Components](https://buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-electronic-components/ "Buehler's Method by Material Electronic Components") - [Stainless Steel](https://buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-stainless-steel/ "Buehler's Method by Material Stainless Steels") - [Cast Iron](https://buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-cast-iron/ "Buehler's Method by Material Cast Iron") - [Carbon Steels](https://buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-carbon-steels/ "Buehler's Method by Material Carbon Steels") - [Nickel and Nickel Alloys](https://buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-nickel-and-nickel-alloys/ "Buehler's Method by Material Nickel and Nickel Alloys") - [Printed Circuit Boards](https://buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-printed-circuit-boards/ "Buehler's Method by Material Printed Circuit Boards") - [Thermal Spray Coatings](https://buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-thermal-spray-coatings/ "Buehler's Method by Material Thermal Spray Coatings") - [Titanium and Titanium Alloys](https://buehler.com/uk/solutions/buehler-solutions/solutions-by-material/solutions-by-material-titanium-and-titanium-alloys/ "Buehler's Method by Material Titanium and Titanium Alloys")