Acrylic Mounting Systems

Acrylic Mounting Systems

Acrylic mounting systems offer a short cure time and are recommended for mounting specimens that are sensitive to high pressures and temperatures. Buehler’s offering includes acrylic liquid, powder and kits designed for different metallographic sample testing applications.

SamplKwick – acrylic mounting compound is designed for rapid and effective encapsulation of PCB coupons. By dipping coupon in Acrylic liquid prior to potting, Buehler’s SamplKwick is able to wet and enter into smaller holes and recesses well, with ease offering good penetration and the edge retention needed for great electronics preparation. To reduce the viscosity of mixed acrylic, powder to liquid volume mixing ratio of 1:1 or 1.5:1 is preferable.

VariKleer – is ideally designed to use with pressure vessel to generate crystal clear acrylic mount resulting harden and minimum shrinkage, to determine the PCB coupon sample grinding to desire level. For crystal clear mount, SamplKup should be used rather than EPDM or Disposable mount.

VariDur – is a fast acrylic system containing filler resulted in harden mount particluarly for metals sample in short curing cycle with compare to epoxies and when edge retension is not critical.

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Applications of Metamaterials

With Prof. Lorenzo Valdevit

An overview of the definitions and classes of metamaterials will be provided with a specific emphasis to the applications as lightweight structural materials. The various features of structural metamaterials will be discussed as well as the role of metal additive manufacturing in enabling the scale of these materials. Future pathways to the implementation of these unique materials will be presented.

Applications of Light Metals

With Dr. Carl Söderhjelm

The lecture will first review the prototypical structures and identifying properties of various industrially relevant light metals. Then, several case studies will be presented to demonstrate the novel use of these materials in light weighting across different fields. The lecture will conclude with emerging materials and tools to design them.

Additive Manufacturing Overview

With Mr. Brandon Fields

The field of metal additive manufacturing will be discussed with a highlight to the variety of technologies currently in use and identify the industry leading techniques. The core principals of each will be presented along with comparisons and use cases for each.

Powder Metallurgy Versus Conventional Processing

With Prof. Diran Apelian or Dr. Ben MacDonald

Powder metallurgy as a class of processing technologies will be covered with an emphasis to the key differentiations with conventional processing. The implication of critical solidification parameters including cooling rate will be reviewed as they affect the refinement of microstructures and the presence of metastable structures. Traditional consolidation approaches to creating bulk parts will be discussed as well as the use of metal powder as a feedstock to additive manufacturing.

The Linkage of Processing Structure Properties

With Dr. Ben MacDonald

This lecture will serve to established and review the core metallurgical principles that are essential to understanding materials as a system. With an overview of the hierarchical structural features of metals, fundamentals of solidification, wrought processing, and heat treatment, the interconnected relationships of processing, structure, and properties will be established.

Current Trends in Light Weighting of Structural Materials

With Prof. Diran Apelian

This lecture will serve as a motivation for the course with emphasis on current trends in light weighting of structural materials. Global context to the need for light weighting will be provided as it is critical to a variety of fields from aerospace to the electrification of transportation. Paths forward will be proposed, specifically the unique potential of metal additive manufacturing to accomplishing these goals. This lecture will conclude by introducing the structure of the lectures that will be presented in the course.