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Precision Diamond Wafering Saws

When sectioning small, delicate or extremely hard materials, precision diamond saws are a must.  These saws primarily use thin, metal bonded diamond wafering blades which allow for more precise cuts, less material (kerf) loss and less induced deformation.  Very thin abrasive wheels can also be used on larger models.  Blade selection is based on the material type.  The goal is to find a blade that will create the best surface finish while providing a suitable cut time for the operator.  In order to have optimum cut times and minimal deformation, it is essential to use ample coolant.  This will provide adequate coolant to keep the sample and blade cool, remove any debris from the cutting area and enable the abrasive to provide the best cutting action.